chip board
英 [tʃɪp bɔːd]
美 [tʃɪp bɔːrd]
网络 刨花板; 灰纸板; 粗纸板; 芯片板
双语例句
- Siebel has recruited a blue chip board, including former Secretary of State Condoleezza Rice and former Energy Secretary Spencer Abraham.
希伯已经组建了一个蓝筹股董事会，成员包括美国前国务卿康多莉扎•赖斯和美国前能源部长斯潘塞•亚伯拉罕。 - She dug small holes in the pot cover and made many small containers of wood chip with a ventilate board to fit those holes.
在锅盖上挖出小洞，用木片做成上圆下尖的小甄，中间用铁皮凿出有透气小孔的隔板。 - Connect devices on a part of a chip or circuit board in a computer.
把设备连接到电脑的芯片上或电路板上。 - Chip on board process compression fittings
基板上芯片装配工艺 - Chip and board designers realize that they only have time and mental resources to focus on those requirements that directly impact their designs.
芯片和电路板的设计人员认识到，他们不仅要将时间和精力重点放在那些直接影响到他们设计的要求上。 - The Study of the Spread and Diffusion Process of Oil Spilled from Seabed Pipeline; Underfill Delamination of Flip Chip on Low-Cost Board
海底管线溢油在水体中的运移扩散过程研究低成本基板倒装焊底充胶分层裂缝扩展研究 - Chip board: A low grade board made from waste wood and paper and used in bindings.
粗纸板：装订用的次等纸板。用木屑和废纸造成。 - A crack, crevice, or split. Underfill Delamination of Flip Chip on Low-Cost Board
裂缝裂隙、缺口或裂缝低成本基板倒装焊底充胶分层裂缝扩展研究 - Cleft palate; deformed condition in which the roof of a person's mouth is split at birth Underfill Delamination of Flip Chip on Low-Cost Board
唇裂（出生时唇板裂开的畸形）.低成本基板倒装焊底充胶分层裂缝扩展研究 - Flip Chip on Board ( FCOB) has been used widely as a microelectronics packaging structural form.
板上倒装芯片（FCOB）作为一种微电子封装结构形式得到了广泛的应用。 - Study of Technological Parameter of Heat Pressed Cotton Stalk Chip for Substituting Wood Packaging Board
棉杆碎料热压代木包装板材的工艺参数研究 - To glue together ( layers of wood) to make plywood. chip on board process
把（木片层）粘合成胶合板基板上芯片装配工艺 - By the way of studying the compressibility of cemented chip board, the effecting factors for the compressibility of board body and the shrinkage ratio on different conditions have been found out.
通过对水泥刨花板压缩比的研究，得出对板坯压缩比的影响因素以及在不同条件下的压缩比值。 - The development of the embedded system involves two respects of software and hardware, hardware mainly including: according to employing the function to choose the systematic chip, board grades of circuit design, system magnitudes of circuit design;
嵌入式系统的开发涉及到软件和硬件两个方面，硬件方面主要包括：根据应用功能进行系统芯片选择，板级电路设计，系统级电路设计等； - The finite element method was used for analysis of heat stress in chip on board ( COB).
本文采用有限元法分析了板上芯片（COB）的热应力分布。 - A new type of high power white LEDs ( HPW-LEDs) based on metal core printed circuit board ( MCPCB) and chip on board ( COB) technique is designed and demonstrated, its opto-electrical characteristics are measured.
设计、制作了基于金属线路板和板上芯片技术的大功率白光LED，对其光电特性进行了实验测量，输入电流达到800mA，对应的输入功率3.3W，大功率LED的输出光通量才达到饱和。 - The welding quality of high-power chip and cool board always keeps back the longevity of domestic switch electronic source. This paper introduces the method of the design of Semiautomatic Welding Machine for Chip detailedly, and provides quite new welding technics.
大功率芯片与散热板的焊接质量一直制约着国产开关电源的寿命，本文详细介绍了半自动芯片焊机的设计方法，提供了一种全新的焊接工艺。 - Study on compressibility of cemented chip board
水泥刨花板压缩比的研究 - Reliability Study of a Flip Chip on Board Assembly
有机印制板上倒装芯片的可靠性研究 - As a packaging technique, COB ( Chip on Board) structure is usually used in IC and MEMS. However, the thermomechanical coupling effect because of CTE mismatch of different materials in COB will greatly affect the reliability and performance of the devices.
COB（chiponBoard）是微电子和MEMS中常用的封装工艺之一，但该封装结构中由于多层异质材料耦合引入的热失配将对器件的性能和可靠性产生重要影响。 - In mass production of LCD module under widely developed market, the assembly process of LCD drive circuits is based on COB ( Chip on Board) technique.
在市场上逐步推广的液晶模块（LCM）生产中，其LCD系列驱动电路的封装工艺主要采用裸芯片的COB（chiponBoard）封装方式。 - Study of waste water treatment in circuit and chip board factory
塑料线路板厂废水处理的研究 - Distribution of Residual Stress in Packaging Assemblies of Chip on Board
板上芯片固化后残余应力分布的有限元模拟 - The design principle of chip microprocessor-CRT interface board is elaborated in this paper. The display method of chip microprocessor is enhanced and the application of chip microprocessor in the monitor system of the procedure is developed as well.
详细阐述了单片机－CRT接口板的设计原理，增强了单片机的显示手段，拓宽了单片机在生产过程监测系统中的应用。 - Boundary-scan Test Design for FPGA Chip on Board
板载FPGA芯片的边界扫描测试设计 - Every drive board can drive a diode laser. The function of control unit single chip in the driver board is to control the aging process of 16 laser diodes in current mode or in output power mode.
驱动板的控制单元-单片机实现对16个半导体激光器的老化过程进行监控，从而使激光器工作在上位机所指定的恒流状态或者恒功状态下。 - Then the hardware structure and the layout of system are briefly introduced, focusing on the chip selection and the board design.
接着对系统的硬件结构与布局进行了简要的分析，主要讨论了芯片选型与板卡设计。 - Robot arm not only can engage in simple works, such as crawl, placing, painting and welding operations, but also can complete complicated tasks, such as installment of integrated circuit chip into printed circuit board and loading and transmission of component in the auto industry.
机械臂从能完成一些简单的抓取、放置、喷漆和焊接操作，发展到能实现在印刷电路板上装插集成电路芯片和在汽车工业中装卸与传送零件这样复杂的操作。 - In this thesis, the reliability and relevant questions of flip chip on board ( FCOB) for harsh environment application were investigated by using thermal shock test.
本文采用温度冲击方法对严酷条件下倒装焊接的可靠性及相关问题进行了深入研究。